Ascend 950DT
#4 v AI inferenční hardwareHuawei · od Q4 2026 (kommerzieller Hardware-Launch); Huawei-Cloud-Verfügbarkeit ab August 2026 · 3× · naposledy 11. 9. 2026
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The Ascend 950DT is a Huawei AI accelerator chip specialized for decode-stage inference and training, part of the Ascend 950 family alongside the 950PR. It uses Huawei's proprietary HiZQ 2.0 HBM memory with 144 GB capacity and up to 4 TB/s bandwidth, plus a 2 TB/s interconnect. The chip is manufactured on SMIC's 7nm (N+2/N+3) process, is set to go live on Huawei Cloud in August 2026 with full commercial hardware launch in Q4 2026; the indicated per-unit price was raised in 2026 to above 250,000 yuan (about $37,000).
Vývoj momenta
15.06.13.09.
Vlastnosti
| Manufacturing Process (nm) | SMIC 7nm-class process (N+2/N+3, DUV multi-patterning) |
| License | Runs on Huawei's proprietary CANN software stack (not CUDA); CANN was open-sourced in part starting August 2025 |
| Platform | Huawei Ascend platform (Da Vinci architecture), used in Atlas 650E server and Atlas 950 SuperPoD/SuperCluster |
| Price | Above 250,000 yuan (~$37,000) indicated unit price, as of September 2026 |
| Compute Performance (FLOPS/TOPS) | 1 PFLOPS FP8 / 2 PFLOPS MXFP4 per chip (top bin up to 2,007 TFLOPS MXFP4) |
| Release Date | Available on Huawei Cloud from August 2026, full commercial launch Q4 2026 |
| Memory | 144 GB HiZQ 2.0 HBM with up to 4 TB/s bandwidth (96 GB configuration also available) |
| Availability | Sold only in mainland China; export restricted worldwide due to US sanctions (Entity List) |